Warpage Prediction of Ball Grid Array Package with the Homogenization Method
نویسندگان
چکیده
منابع مشابه
A New Approach to the Ball Grid Array Package Routing
Due to the large number of I/O’s in a BallGrid-Array (BGA) package, routing becomes more and more an important work. A ring-based router for the BGA package is presented in this paper to interconnect each I/O pad of a chip to a corresponding ball distributed on the substrate area. The major phases for the router consist of layer assignment, topological routing, and physical routing. Using this ...
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Mention Tape Ball Grid Array (TBGA) and the first thing comes to mind is the high cost. In fact, most end users rightfully associate TBGA with the less commonly practiced assembly processes such as Tape Automated Bonding (TAB) and expensive gold bump process. This impression of TBGA repels end users and limits TBGA to mostly high end applications and a very narrow spectrum of lead counts. Times...
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An even-wiring router for the BGA package is presented in this paper to interconnect each I/O pad of a chip to a corresponding ball distributed on the substrate area. The major phases for the router consist of layer assignment, topological routing, and physical routing. Using this router, we can generate an even distribution of planar and any-angle wires to improve manufacturing yield. We have ...
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ژورنال
عنوان ژورنال: Journal of The Japan Institute of Electronics Packaging
سال: 2013
ISSN: 1343-9677,1884-121X
DOI: 10.5104/jiep.16.70